A major breakthrough at Peking University might have just found the first step beyond silicon for semiconductors.

At Embedded World 2025 in Germany, Intel unveiled its Panther Lake processor, a key part of the Core Ultra 300H/U series and ...

By way of example, TSMC's N3E node as used in the latest Apple chips has gate pitch of at minimum 45 nm and a metal pitch of ...

Peking University has published its findings on a wafer-scale 2D GAAFET in Nature, pointing a new path into the Angstrom era ...

As the semiconductor industry moves to smaller scales, it must overcome several technical challenges. Read more here.

We expect Teradyne to maintain a strong balance sheet and continue generating robust free cash flow while keeping minimal to no leverage. As of Dec. 31, 2024, Teradyne held a net cash position, with ...

To achieve smaller semiconductor structures, improved transistor designs are essential. Leading-edge fabs have been working ...

According to Lam Research, this etching equipment supports next-generation semiconductor manufacturing processes, including advanced dynamic random-access memory (DRAM) and 3D NAND flash memory, with ...

Like all foundries, it assumes the costs and capital expenditures of running factories amid a highly cyclical market for its customers. Foundries tend to add excessive capacity during times of ...

You can check out at any time. More info The GAA has rescheduled a number of League fixtures that weren’t played last weekend for next month. The headline fixture that fell victim to the weather ...

(Image: Intel.) Intel 18A will also be built using RibbonFET gate-all-around (GAA) transistor technology that the company says will “enable precise control of electrical current. RibbonFET allows ...

Consequently, LER must be meticulously considered before fabricating integrated circuits. In this study, we present an approach for implementing and analyzing LER in vertical channel array transistors ...