A major breakthrough at Peking University might have just found the first step beyond silicon for semiconductors.

At Embedded World 2025 in Germany, Intel unveiled its Panther Lake processor, a key part of the Core Ultra 300H/U series and ...

By way of example, TSMC's N3E node as used in the latest Apple chips has gate pitch of at minimum 45 nm and a metal pitch of ...

Peking University has published its findings on a wafer-scale 2D GAAFET in Nature, pointing a new path into the Angstrom era ...

As the semiconductor industry moves to smaller scales, it must overcome several technical challenges. Read more here.

We expect Teradyne to maintain a strong balance sheet and continue generating robust free cash flow while keeping minimal to no leverage. As of Dec. 31, 2024, Teradyne held a net cash position, with ...

To achieve smaller semiconductor structures, improved transistor designs are essential. Leading-edge fabs have been working ...

According to Lam Research, this etching equipment supports next-generation semiconductor manufacturing processes, including advanced dynamic random-access memory (DRAM) and 3D NAND flash memory, with ...

Like all foundries, it assumes the costs and capital expenditures of running factories amid a highly cyclical market for its customers. Foundries tend to add excessive capacity during times of ...

You can check out at any time. More info The GAA has rescheduled a number of League fixtures that weren’t played last weekend for next month. The headline fixture that fell victim to the weather ...

(Image: Intel.) Intel 18A will also be built using RibbonFET gate-all-around (GAA) transistor technology that the company says will “enable precise control of electrical current. RibbonFET allows ...