The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. From a market segment perspective, MLF/QFN packaging solutions represent a >111B-unit market across five unique ...

Leading IC manufacturing and technology services provider increases chip-on-wafer (CoW) yield by 3.3% from 96.47% to 99.66% with Nordson Electronics Solutions.

Fan-out Wafer-Level (FOWLP) and Fan-out Panel-Level (FOPLP) semiconductor packaging benefit from plasma treatment, which ensures surfaces are contamination-free to aid the attachment process, ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Two case studies show the effectiveness of high-res 3D ...

Two case studies show how advanced high-resolution 3D XRM can detect and visualize defects in Wafer Level Chip Scale Packages (WLCSP) containing RDL and Cu pillar microbumps.

Cimetrix by PDF Solutions develops factory automation software used by some of the most expensive factories globally that ...

Ultrasonic die bonding revolutionizes semiconductor assembly with rapid processing, strong bonds, and low thermal stress. It excels in bonding dissimilar materials, advancing applications like power ...

Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for a multitude of packaging ...

StratEdge paper details how to reduce chip-to-package junction temperature to improve GaN chip efficiency and reliability. Learn more about specialized packages for GaN devices and perfecting the ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. EVG's industry-leading process solutions, expertise ...

Explore the vital role of packaging GaN devices! This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn.

Chiplets represent a transformative approach to semiconductor design providing innovation and customization. This paper underscores the critical relationship between chiplets and material testing.